1. 3D stacking technology, lipstick size, does not occupy the space and is easy to carry.
2. The third-generation semiconductor GaN chip is adopted, which reduces the size, and is energy-efficient, low-carbon and environmentally friendly.
3. Precision potting process, stable structure, and efficient heat dissipation, charges with more safety.
4. Muti-protocol compatibility, meets the needs of various mainstream devices.